Ka nana ana onā kalaiwaMa mua o ka hoʻomaʻamaʻa wela, ʻo ia ke kaʻina hana mua no nā huahana i hoʻopau ʻia i nā kiʻi forging a me ke kaʻina hana CARDS ma hope o ka pau ʻana o ke kaʻina hana forging, me ka maikaʻi o ka ʻili, ka nui o nā hiʻohiʻona a me nā kūlana ʻenehana.

（1）ʻAʻole pono ke ʻano o ka forging mai nā māwae a me nā hemahema e like me ka ʻōpala, ka unahi oxide a me ka ʻeha e pili ana i ka maikaʻi o ka mālama wela.

（2）Pono e hōʻike i ke kiʻi forging i nā ana nui, nā ʻāpana ʻano kūikawā, nā ʻāpana ʻāpana like ʻole, ke ʻano a me ke kūlana o nā lua.

（3）ʻO ka nui a me ka pololei o nā ʻāpana e mālama ʻia e hōʻike i ka ʻae ʻana i ka mīkini, ka ʻili o ka ʻili, ka pololei o ke ana, ka pololei o ke kūlana a me ka pololei o ke ʻano, etc.

（4）Hiki i nā mea nānā ke nānā i ka nui o ka underpressure e like me 10% -20% o ka helu o ka hoʻomaʻamaʻa wela.I ka wā o ka pūʻulu oke kalaiwa anae like me ke kaha kiʻi, hiki iā lākou ke komo i ke kaʻina hana.

（5）E nānā i ka pahu o nā huahana i hoʻopau ʻia ma mua o ke kinai ʻana, 1-2 mau ʻāpananā kalaiwa(ʻaʻole hiki ke hoʻohana ʻia nā mea ʻōpala i pelu ʻia a māwae no ka laʻana) e hoʻokomo ʻia i loko o ka pahu no ka laʻana, a e kaha ʻia ka huaʻōlelo "sampling" ma ka ʻōpala e hōʻike i ka ʻokoʻa.

（6）Ma hope o ka nānā ʻana, pono e hoʻopiha pono ʻia ka nui o ka huahana i hoʻopau ʻia, ka nui o ka ʻōpala hiki ke hoʻoponopono ʻia, ka nui o ka ʻōpala hope a me ke code defect i loko o ke kāleka e pili pū ana a kau inoa ʻia e nā mea nānā.